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Senior Quantum Thin Film Engineer | Engineer in Engineering Job at Microsoft in Redmond WA | 724661

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Senior Quantum Thin Film Engineer

Location:
Redmond, WA
Description:

Microsoft Quantum is dedicated to solving the world's intractable problems and altering our economic, industrial, academic, and societal landscape. In just hours or days, a quantum computer can solve complex problems that would otherwise take today's computers billions of years! This has massive implications for research in healthcare, energy, environmental systems, smart materials, and more. Most importantly, Microsoft brings the only scalable quantum system to the broadest set of customers. For more information about our team, visit https://www.microsoft.com/en-us/quantum.Microsoft Quantum is seeking a highly skilled and motivated Senior Quantum Thin Film Engineer to join our team. This is an exciting opportunity to contribute to the cutting-edge field of quantum computing. The successful candidate will be tasked with developing processes for dielectric and metal thin film deposition and quantum transport device fabrication. This role requires a deep understanding of semiconductor physics, device fabrication, and crystal chemistry.Microsoft's mission is to empower every person and every organization on the planet to achieve more, and we're dedicated to this mission across every aspect of our company. Our culture is centered on embracing a growth mindset and encouraging teams and leaders to bring their best each day. Join us and help shape the future of the world.In alignment with our Microsoft values, we are committed to cultivating an inclusive work environment for all employees to positively impact our culture every day. Qualifications: Required/Minimum Qualifications 7+ in Materials Science, Electrical Engineering, Physics OR Bachelor's degree in Materials Science, Electrical Engineering, Physics or related field AND 5+ years experience in industry or in a research and development environment OR Master's degree in Materials Science, Electrical Engineering, Physics or related field AND 3+ years experience in industry or in a research and development environment OR Doctorate degree in Materials Science, Electrical Engineering, Physics or related field. Proficient in semiconductor physics, device fabrication, and crystal chemistry. Competent in using various analytical and metrology tools. Other Requirements Ability to meet Microsoft, customer and/or government security screening requirements are required for this role.These requirements include, but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter. Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations.As a condition of employment, the successful candidate will be required to provide proof of citizenship, U.S. permanent residency, or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable. Additional or Preferred Qualifications: Experimental lab work. Experience with installing or maintaining complex equipment. Statistics Coursework, Statistical Process Control (SPC) or Design of Experiments (DOE) principles. Familiarity with Thin Film Deposition techniques. Semiconductor processing fundamentals (lithography, wet etch, dry etch, chemical and or mechanical polishing, etc.). Materials and physical device characterization (SEM, TEM, etc.) and fundamentals of semiconductor device testing. Data analysis skills with demonstrated ability to construct clear data-based problem statements. Experience with data analysis software (MATLAB, Python, JMP, etc.), scripting, and data visualization. Successful mentorship to less experienced engineers and technicians. Experience in foundry operations is highly desirable. Excellent problem-solving skills and attention to detail. Hardware Engineering IC4 - The typical base pay range for this role across the U.S. is USD $112,000 - $218,400 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $145,800 - $238,600 per year.Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-payMicrosoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form.Benefits/perks listed below may vary depending on the nature of your employment with Microsoft and the country where you work.#quantum Responsibilities: Conduct research to improve thin film deposition processes for dielectric, metal, and superconducting materials. Collaborate with the engineering team to integrate new thin film deposition processes into existing manufacturing operations. Ensure all thin film deposition processes meet industry standards and safety regulations. Document all thin film deposition procedures and results in a clear and concise manner. Collaboration with our quantum measurement physicists to determine which performance metrics for our quantum transport devices are most affected by our deposition processes. Perform iterative improvements to these processes to improve device functional metrics. Coordinate thin film deposition tools downtime with the on-site equipment engineer and forecast consumable needs or required modifications to the tools. Other Embody our Culture and Values Requisition #: 1695307pca3lyuhf
Company:
Microsoft
Posted:
April 22 on ITJobsWeb
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