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Packaging Engineer - Photonics | Engineer in Engineering Job at Deepsight Technology in State Coll1

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Packaging Engineer - Photonics

Location:
State College, PA
Description:

Company Description DeepSight Technology Inc. is a stealth mode startup company that has developed breakthrough technology in ultrasound imaging. This new technology will both extend the range and clarity over current systems by 10x - 100x! We are setting new standards that will dramatically improve the capabilities of ultrasound for many years.In order to develop and improve this technology, we need dedicated team players on our side. Not only do we offer a great team-oriented environment , but we also offer a competitive salary of $60,000-$166,000 a year, based on skills, experience, and office location. This position also earns generous benefits in both our St. Louis, MO and Santa Clara, CA offices. Job Description In this role, as a member of a multi-disciplinary product development team, you will own the packaging development from concept to production for state-of-the-art photonic integrated circuits (PICs). You will be also involved in integrating photonics components with other modules in the system. This position will be looking for someone who can design, develop, and validate a low-cost, high performance and reliable packaging platform for photonics components and system integration.Responsibilities include:Conceive novel concepts for low-cost fiber packaging through optical/mechanical design and modeling of photonic chip coupling interfacesSimulate the performance of optical assemblies, with a mind towards the interface between PICs and package, as well as manufacturing tolerances.Characterize and qualify the developed packaging solution (optical/mechanical/reliability) with device and systems engineers.Work with contract manufacturers to define design rules for manufacturing.Document and report to internal members and communicate with external vendors and partners Qualifications You should have the following skills/qualities/experiences:BS or above a relevant technical field (Optics, Mechanical, Electrical, Materials Science, Applied Physics, or similar)5+ years of hands-on experience in packaging fiber-coupled devices and photonics integrated circuits chips.Experience designing for manufacturability and automated assembly and characterizationKnowledge of fiber-optical systems and optical polymersExperience with 3D printing and/or CNC machining is preferredAbility to read and interpret engineering specifications, drawings, manufacturing instructions, and technical analyses.Industry experience creating detailed design documentation (specifications, design descriptions, verification, and testing plans). Other Qualities We Are Looking For Positive - a can-do attitude that helps you rise to challengesCollaborative - a team player who can effectively communicate with othersAttentive to detail - nothing gets by youEfficient - a knack for effectively prioritizing tasks and managing your timePride in your work - real desire to do quality workCareer-minded - looking for more than a job Benefits and Perks We offer great benefits and perks:Competitive salaryStock optionsMedical, dental, and vision insurance401(k) retirement plan Job Posted by ApplicantPro
Company:
Deepsight Technology
Posted:
December 26 2023 on ApplicantPro
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More About this Listing: Packaging Engineer - Photonics
Packaging Engineer - Photonics is a Engineering Engineer Job at Deepsight Technology located in State College PA. Find other listings like Packaging Engineer - Photonics by searching Oodle for Engineering Engineer Jobs.