3D-IC Probe Technology Development Lead

This listing was posted on ITJobsWeb.

3D-IC Probe Technology Development Lead

Location:

Hillsboro, OR

Description:

Job Description Do Something Wonderful! Intel put the Silicon in Silicon Valley. No one else is this obsessed with engineering a brighter future. Every day, we create world changing technology that enriches the lives of every person on earth. So, if you have a big idea, let's do something wonderful together. Join us, because at Intel, we are building a better tomorrow. Want to learn more? Visit our YouTube Channel or the links below! * Life at Intel * Diversity at Intel Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Role and Responsibilities This role is responsible for the development of new methodologies, technologies and equipment to probe working electric circuits and obtain on-die electrical data in extremely complex multi-layered die (3-D stacking). This data is used in failure analysis, debug of logic faults, yield improvement and root cause of timing marginalities etc., for next generation of Intel process technology and products. The candidate will have strong innovation and collaboration skills and the ability to work with internal developers across Intel divisions and organizations. Will need to work with design, packaging and product groups to influence new methods to achieve data acquisition from multi-stacked die and a complex packaging solution. The successful candidate must possess the ability to apply systems analysis techniques, procedures, including consulting with users, to define potential approaches, in-depth experiments/proof of concepts to generate successful outcomes and the best throughput time for root-cause and data collection efficiency. The role also includes working with Intel product groups to enable best access to silicon data through design for debug (DFD) methods, helping to drive the requirements for sample preparation and defining potentially new software means to achieve data from on-die circuits, while minimizing the use of physical probe debug/FA tools. Will need to document tests, create or modify presentations for updates to various forums, and document best known methods for use of techniques developed for use in the various labs. The job requires the ability to handle multiple tasks, and demonstrate advanced engineering problem solving, team work and ability to work with minimum supervision and tactical direction. Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: The candidate must have a Bachelor's degree in Electrical/Computer Engineering, Physics or a related STEM field with 6+ years' experience OR Master's degree in Electrical/Computer Engineering, Physics or a related STEM field with 4+ years' of experience OR PhD degree in Electrical/Computer Engineering, Physics or a related STEM field with 2+ years' of experience Knowledge in 3 or more of the following areas: advanced CMOS-VLSI circuits, electronics, device physics and fab process flows, materials characterization and measurement techniques. Previous experience in Technology Development. Preferred Qualifications: Some engineering knowledge and experience with both Optical and Electronic Beam Microscopy Physical Silicon probing and Metrology tools is an advantage. Knowledge of software and means to use algorithms and on-die circuits to acquire FA and circuit behavior data a plus. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Inside this Business Group Manufacturing and Product Engineering (MPE) is responsible for test development across product segments, supporting 95% of Intel's revenue. We deliver comprehensive pre-production test suites and component/physical debug capabilities to enable high quality, high volume manufacturing. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Working Model This role will require an on-site presence.Requisition #: JR0262631pca3lyuhf

Company:

Intel

Posted:

May 4 on ITJobsWeb

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3D-IC Probe Technology Development Lead | d-Ic Probe Technology in Job Job at Intel in Hillsboro O1

3D-IC Probe Technology Development Lead

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